Bron: X
Market Rumors
NVIDIA to Cut 90,000 Units of Advanced Packaging Orders for 2025
•TSMC: 50,000 units cut
•Professional OSAT (Outsourced Semiconductor Assembly and Test): 40,000 units cut
•This is a substantial order cancellation, not just a transition from CoWoS-S to CoWoS-L, as NVIDIA previously claimed.
GB300: Rubin GPU & Vera CPU Timeline
•Tape-Out scheduled for June 2025
•Mass production expected as early as early 2026
•Manufactured using N3P, N3B, and N5 processes
•Confirmed to use CoWoS-L packaging
•12-Hi HB4 HBM exclusively supplied by SK Hynix
CPO (Co-Packaged Optics) Adoption Timeline
•CPO will only begin with GB300
•GB200 will continue using the original CPC (Conventional Packaging Concept)
NVIDIA’s GTC Conference on March 17
•GB300 Rubin NVL288 specifications to be released in the agenda
•If all goes well, shipments will begin in 2026
•Announcements to be made during the GTC event
Foreign Institutions’ Interpretation of GB300
•GB200: Previously, one rack had 72 GPUs (NVL72)
•GB300: Now, one rack will have 288 GPUs (NVL288)
•Denser GPU arrangement to reduce copper wire transmission limitations
•Full liquid cooling system required for thermal management
•CPO will only be applied to switches, as the technology is not yet fully mature
•Networking speed upgrade from 400G to 800G
•High-end PCB boards provided by TGC (Taiwan Glass Circuit, ???)
•Enhanced connectivity with quick connectors and replaceable sockets for easier maintenance
•Key suppliers: Jiaze, FIC, Foxconn Interconnect
•Memory capacity expanded to 288GB
•HBM3E 12-Hi provided by SK Hynix, Samsung, and ASE
•Standardized capacitors supplied by Musashi Japan
•BBU (Battery Backup Unit) officially included in specifications
•Key suppliers: AES, ShunDa, XSL
Summary & Interpretation
1. NVIDIA has cut 90,000 units of advanced packaging orders for 2025, signaling a possible AI market adjustment.
2. GB300 (Rubin GPU & Vera CPU) is on track for tape-out in June 2025 and mass production in early 2026.
3. The transition from NVL72 (72 GPUs per rack) to NVL288 (288 GPUs per rack) will improve efficiency but necessitate full liquid cooling.
4. CPO will only be partially adopted for switches, while networking speeds will double from 400G to 800G.
5. GTC on March 17 will reveal GB300 details, and shipments could start in 2026.